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Form-Factor Driven SWaP-C Optimizations for Embedded Realtime Signal Processing Systems
Richard Crisp (VP & CTO, Etron Technology America)
Location: Room 204
Date: Wednesday, August 28
Time: 8:00am - 8:55am
Track: ESC - Embedded Hardware Design & Verification, ESC - IoT & Connected Devices
Format: Technical Session
Vault Recording: TBD
This session will examine strategies for attaining size, weight, and power goals all within a cost constraint for next-generation Embedded Signal Processing systems. Wearable, flyable, and other portable systems impose constraints beyond traditional systems. Component and packaging solutions exist for the smartphone market but are not general purpose or portable to the unique requirements for other applications. TSV and other custom silicon level solutions attain smallest possible sizes but on long multi-year custom silicon development schedules and requiring complex logistics for supporting TSV-based assembly of components from a multitude of manufacturers in competition with each other. This session emphasizes matching "good enough" solutions with system requirements while exploiting new component developments to achieve an overall optimized solution giving competing demands for size, weight, power, cost, and schedule.