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Welcome to the Drive World with ESC 2019 Presentation Store. Here you can view and download conference presentations before, during, and after the event. If you’re looking for a presentation from a specific session that you’re unable to find here, note that it’s likely because the presenter has not provided permission for external use or has not yet shared their presentation with us. Please check back after the event for a more complete catalogue of available presentations.

The Democratization of SIP Integration

Gene Frantz  (CTO, Octavo Systems)

Erik Welsh  (Applications and Systems Manager, Octavo Systems)

Location: Room 204

Date: Thursday, August 29

Time: 8:00 am - 8:55 am

Track: ESC - Embedded Hardware Design & Verification, ESC - Advanced Technologies

Format: Technical Session

Vault Recording: TBD

The driver of the electronics industry, especially embedded systems has always been integration. However, as we reach the end of Moore's Law, integration on silicon has become increasingly difficult and costly, if not impossible. The industry has turned to technologies like System-in-Package (SiP) to continue to offer the integration that electronics designers have come to demand. Like silicon integration, System-in-Package integration has been reserved for large volume or large dollar opportunities and customers. Fortunately, there are capabilities on the horizon, which will open integration through System-in-Package to companies no matter their volume, allowing designers a unique blend of power, performance, and size, customized for their application.

This session will discuss the transition taking place that will allow system designers the ability to use SiP as a customized integration path. While traditional SiPs are monolithic systems that require huge up-front investments to design and verify, new techniques will reduce these barriers, providing the integration of an SoC with the flexibility of a PCB. We will discuss specific issues and advantages that include functionality, performance, reliability, power dissipation, design cost and minimum order quantities. Finally, we will further discuss specifics of several new options in SiP design methodology and technology that allows system designers to take advantage of this integration by designing both semi-custom and full custom system implementations in a single packaged device. These advances enable the proliferation of SiP technology to entrepreneurs of any application such as IoT, AI or industrial automation.